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Bluetooth module

BT-MC23-HS3

Main parameter

•Chipset:CYW20713

•Module dimension(mm):14.2*12.6*2.3mm

•BT Versions:v5.3

•Operating temperature:-40~85℃

•Mac:Single

•Voltage:2.8~3.5V

•Frequency Range(GHz):2.4GHz

•Power class level:Class 2

•Interface:URAT、PCM/I2S

•Application:Automative

•Protocol/features:HCI BT_MODULE A2DP、AVRCP、HFP、HSP、SPP、GATT、PBAP、AEC-Q100


Data download:

Product introduction

BT-MC23-HS3 is a low-cost Bluetooth module that integrates a single-chip Bluetooth baseband processor, and complies with the Bluetooth v5.3 specification.